QDSP-3000 Digital Signage Player Front View
QDSP-3000 Digital Signage Player Rear I/Os
QDSP-3000 Digital Signage Player Front I/O Ports
VESA / Keyhole Mount Kit (0F0400000001240L)
Optional Stand Bracket (0F0300000006090L)

QDSP-3000 Series

Intel® Kaby Lake / Skylake S Based Digital Signage Media Player

 

Features:

  • Intel® Skylake / Kaby Lake S-Series Processors (LGA1151 Socket)
  • Intel® H110 / Q170 Chipset
  • 2x DDR4 SO-DIMM
  • 2x HDMI2.0, 1x DP for video output
  • 1x Line-in, 1x Line-out, 1x Mic-in, 1x S/PDIF for audio input / output
  • 2x GbE LAN for Ethernet
  • 6x USB3.0 or 4x USB3.0 + 2x USB2.0, 1x RS-232/422/485 for peripheral connection
  • 1x 2.5″ SATA HDD / SSD, up to 2x mSATA for storage
  • Up to 2x mPCIe for expansion
  • TPM and iAMT support (Q170 models only)
Kaby Lake
Skylake
Triple Display
Dual Display
DDR4
HDMI2.0
TPM
Lockable Power Connector
SKU: QDSP-3000, QDSP-3001, QDSP-3010, QDSP-3011 Categories: , , Tags: , , , ,

Description

The QDSP-3000 Series is a BOX PC powered by Intel® Skylake / Kaby Lake S-Series Processors with up to Intel® HD Graphics 630 integrated and support for up to 32GB 2x DDR4 SO-DIMM memory. Combined with a variety of video / audio interfaces, including 2x HDMI2.0, 1x DP, 1x Line-in, 1x Line-out, 1x Mic-in and 1x S/PDIF, it is an ideal platform for video and graphics intensive applications, such as digital signage, medical imaging or gaming.

Equipped with 1x 2.5″ SATA HDD / SSD, 6x USB, 1x RS-232/422/485, 2x GbE LAN, 2x mPCIe or 2x mPCIe/mSATA, it provides multiple interface options for data storage / backup, peripheral and network connection / expansion to match the varieties of possible applications. In addition, the compact volume allows easy integration into space-constrained applications.

Specifications

System

Microarchitecture

Intel® Kaby Lake, Intel® Skylake
Processor

Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7
Core Number

2, 4
Cache

3M, 4M, 6M, 8M
Frequency

2.20 ~ 3.60 GHz
Socket

FCLGA1151
TDP

35W
Graphics

Intel® HD Graphics 510 (Skylake Celeron® models)
Intel® HD Graphics 530 (Skylake Core™ models)
Intel® HD Graphics 610 (Kaby Lake Celeron® models)
Intel® HD Graphics 630 (Kaby Lake Core™ models)
Chipset

Intel® H110, Intel® Q170
Memory

2x DDR4 1866/2133 SO-DIMM up to 32GB (Skylake models)
2x DDR4 2133/2400 SO-DIMM up to 32GB (Kaby Lake models)

Display Interface

HDMI2.0

2 (on rear, 4096 x 2160 @ 60Hz)
DP

1 (on rear, 4096 x 2304 @ 60Hz)

Multiple Display

Multiple Display

Dual (H110 models)
Triple (Q170 models)

Audio

Audio Codec

Realtek ALC662
Line-In

1 (on front)
Line-Out

1 (on front)
Mic-In

1 (on front)
S/PDIF

1 (on front)

Ethernet

10/100/1000 LAN

2 (RJ-45 on rear, Intel® I219-LM, Intel® I210-AT)

USB

USB3.0

4 (Type A on front, H110 models)
6 (Type A on front, Q170 models)
USB2.0

2 (Type A on front, H110 models)

Serial Port

RS-232/422/485

1 (DB9 on rear)

Storage & Expansion

SATA2

1x 2.5" SATA2.0 HDD / SSD Slot
mSATA / mPCIe

2 (1x full size, 1x half size, Q170 models)
mPCIe

2 (1x full size, 1x half size, H110 models)
SIM Card Holder

1 (on board)

Power

Connector

Lockable DC Jack (on rear)
Input Voltage

DC 19V
Power Adapter

AC to DC, 100V ~ 240V

Firmware

BIOS

AMI uEFI BIOS w/ 128Mb SPI Flash
Watchdog

Programmable WDT to generate system reset event
H/W Monitor

CPU & System Temperatures, Input & Core Voltages
Real Time Clock

Chipset integrated RTC
TPM

Supported for Q170 models
Infineon SLB 9660 TPM 1.2 for Skylake models
Infineon SLB 9665 TPM 2.0 for Kaby Lake models
iAMT

Supported for Q170 models

System Control & Monitoring

Button, Switch & Indicator

1x Power Button (on front), 1x Power Button w/ LED (on front), 1x Storage LED (on front), 1x Wireless LED (on front)

Cooling

CPU Smart Fan

1

Software

OS Support

Windows 7 (Skylake model only)
Windows 8 (Skylake model only)
Windows 10
Linux

Mechanical Characteristics

Construction

Metal Chassis
Dimensions (W x D x H)

200 x 152.8 x 41.5 mm / 7.87" x 6.02" x 1.63"
Weight

1000 g / 2.20 lb
Mounting

Stand Mount, VESA Mount

Environmental Characteristics

Operation Temperature

0°C ~ 50°C / 32°F ~ 122°F (Skylake models)
0°C ~ 40°C / 32°F ~ 104°F (Kaby Lake models)
Storage Temperature

-20°C ~ 80°C / -4°F ~ 176°F (Standard)
Humidity

0% ~ 90%

Certifications

EMC & Safety

CE, FCC Class A
Model Name Description
QDSP-3000 Intel® Skylake S-Series Processors, Intel® H110 Chipset, 2x DDR4 SO-DIMM, 2x HDMI2.0, 1x DP, 2x GbE, 4x USB3.0, 2x USB2.0, 1x RS-232/422/485, 2x mPCIe, w/o TPM, w/o iAMT, Operating temperature: 0°C ~ 50°C
QDSP-3001 Intel® Skylake S-Series Processors, Intel® Q170 Chipset, 2x DDR4 SO-DIMM, 2x HDMI2.0, 1x DP, 2x GbE, 6x USB3.0, 1x RS-232/422/485, 2x mSATA / mPCIe, w/ TPM, w/ iAMT, Operating temperature: 0°C ~ 50°C
QDSP-3010 Intel® Kaby Lake S-Series Processors, Intel® H110 Chipset, 2x DDR4 SO-DIMM, 2x HDMI2.0, 1x DP, 2x GbE, 4x USB3.0, 2x USB2.0, 1x RS-232/422/485, 2x mPCIe, w/o TPM, w/o iAMT, Operating temperature: 0°C ~ 40°C
QDSP-3011 Intel® Kaby Lake S-Series Processors, Intel® Q170 Chipset, 2x DDR4 SO-DIMM, 2x HDMI2.0, 1x DP, 2x GbE, 6x USB3.0, 1x RS-232/422/485, 2x mSATA / mPCIe, w/ TPM, w/ iAMT, Operating temperature: 0°C ~ 40°C

 

QDSP-3000 Series Digital Signage Player Datasheet

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QDSP-3000 Series Digital Signage Player User Manual

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QDSP-3000 Series Intel Graphic Driver

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QDSP-3000 Series Intel Chipset Driver

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QDSP-3000 Series Intel LAN Driver

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QDSP-3000 Series Intel ME Driver

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QDSP-3000 Series Intel USB3.0 Driver

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QDSP-3000 Series Realtek HDA Driver

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QDSP-3000 Series COM Patch File

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QDSP-3000 Series Digital Signage Player Rear I/O Ports

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